Jimsi adheres to the path of developing enterprises through science and technology, continuously introduces advanced technology and high-end technical talents, and improves scientific research level through both connotation and extension, gradually forming a series of domestically produced new products.
Fully support the SECS/GEM communication protocol;
Automated and intelligent online analysis and addition system for nickel, palladium, and gold tanks;
Automatic liquid dispensing, replenishment, and acid exchange;
Temperature, flow rate, concentration, pressure, controllable and adjustable;
Support modular maintenance to improve equipment uptime;
The software has a reverse function, and slot positions can be freely selected and combined;
The equipment process slot has a special flow field distribution design, effectively improving the uniformity of the coating;
Equipment automation operation, dry in and dry out;
We can provide overall solutions for equipment, medicine, and processes.
Fully support the SECS/GEM communication protocol;
Electroplating: Cu, Ni, Sn/Ag, Au;
Supports 3 loadports;
Support the expansion of 16 electroplating chambers;
Support the expansion of 4 pre wetting chambers and 4 cleaning chambers;
Special defoaming mechanism to eliminate bubbles in the plating solution;
The system is equipped with dual System controllers, with no risk of downtime;
Support electroplating chamber stirring function, with adjustable frequency;
Equipped with imported high-precision DC pulse power supply;
Support modular maintenance to improve equipment uptime;
The separation technology of anode and cathode improves the stability of the plating solution.
Fully support the SECS/GEM communication protocol;
Electroplating: Cu, Ni, Sn/Ag, Au;
It can support single and double-sided electroplating, as well as simultaneous electroplating of multiple pieces;
Support modular maintenance to improve equipment uptime;
Temperature, flow rate, concentration, pressure, controllable and adjustable;
Can customize R&D customized machines for various research institutions;
Optional multiple loadports, equipped according to production capacity;
Can provide overall solutions for equipment, medicine, and process;
Equipment automation operation, dry in and dry out
Process indicators:
Stacking design can accommodate up to 12 chambers
The upper and lower transport systems provide a throughput of up to 350wph
Can be configured for front and back cleaning, with up to 5 types of medicinal liquids, and 2 types of medicinal liquids can be recycled
The chamber can be equipped with a two fluid atomization nozzle
The chamber can minimize chemical splashes and ensure a clean wafer processing environment
The dynamic balance and uniformity of the ultra clean air in the chamber are good
Development of advanced transportation systems and proprietary algorithms through put: 400WPH;
Equipped with nitrogen atomization for two fluid cleaning;
Adopting anti-static pipelines and adjustable CO2 generator resistivity;
Equipped with customized soft brush cleaning and scanning to the edge for brushing;
The wafer flipping function allows for back and front cleaning;
Configure 8 sets of brush cleaning chambers and 2 sets of flipping mechanisms.
Suitable for cleaning 8-inch or 12 inch wafers
Equipped with adjustable temperature nitrogen drying
High precision flow control and temperature control for various medicinal liquids
Can carry out liquid medicine recovery to increase the utilization rate of liquid medicine
Up to 8 sets of cleaning chambers can be configured
Can be configured with various medicinal liquids such as hydrofluoric acid, ozone water, etc
Equipped with a combination of slot soaking and single piece rotating spray to improve production efficiency and reduce production costs;
High pressure or two fluid spraying can completely remove the photoresist;
Recycle and recycle the adhesive solution, filter and reuse it, reduce user costs, and recycle precious metals;
Dry in and wet out of the substrate, wet out of the soaking tank below the robotic arm, with a leaking tray;
Can be customized for drug circulation filtration, foaming, residue, etc., to solve process problems;
Customizable configuration, acid mixing and supply equipment, supporting diversified processes
Fully support the SECS/GEM communication protocol;
Equipment automation operation, dry in dry out (Marangoni dry or spin dry)
Equipped with an automatic fire safety system;
Automatic liquid dispensing, replenishment, and acid exchange;
Temperature, flow rate, concentration, pressure, controllable and adjustable;
Optional multiple loadports, equipped according to production capacity;
Full process monitoring and sensor safety interlock;
Full online technical support.
Fully support the SECS/GEM communication protocol;
Equipment automation operation, dry in dry out (Marangoni dry or spin dry;)
Equipped with an automatic fire safety system;
Automatic liquid dispensing, replenishment, and acid exchange;
Temperature, flow rate, concentration, pressure, controllable and adjustable;
Optional multiple loadports, equipped according to production capacity;
Full process monitoring and sensor safety interlock;
Full online technical support.
Mattson is authorized to produce new machines from the original factory
Wide temperature range (100 ° C to 250 ° C)
Double crystal wafer processing controlled by microcontroller, with good process uniformity
Vacuum load lock isolation process room to reduce defects
High speed robot for simultaneous processing of polycrystalline wafers - High throughput (> 130 wph)
Small footprint with the highest throughput/square footprint in strip products smaller than 200mm
Compared to microwave source strip products, the cost of consumables is lower
VTM transmission to better ensure device particle requirements
Single cavity or dual cavity process selection, single cavity can process two pieces simultaneously
Supports 4 to 8-inch wafers
Strip rate: ≫ 5.6um/min
Uniformity within wafer (descum):< 5%
Uniformity within wafer (strip):< 5%
Uniformity wafer to wafer (strip): ≪ 5%
Uniformity run to run (strip): ≪ 5%
Uptime: ≫ 90%
1 minute process time (WPH):; one hundred and sixty
Particle (0.3um):& Lt; 50ea
Uniform gel development process suitable for 4-8 inch silicon-based or compound applications
Maximum equipment configuration: 4 sets of uniform glue/development, 10 sets of hot (cold) plate units, and 1 set of HMDS units
According to customer process requirements, adhesive temperature and humidity control can be added
Compatible with 4+6 inch or 6+8 inch wafer sizes
The whole machine is suitable for batch production lines with high production capacity requirements
Optional MES protocol conversion module
Rotation speed range: 20-5000rpm
Acceleration range: 20-20000rpm/s
Speed accuracy: soil 1rpm
Hot plate temperature range: 50 ° C-260 ° C
Hot plate temperature uniformity: ± 1% or higher
Cold plate temperature range: 20 ° C-25 ° C
Uniformity of cold plate temperature: soil 0.2C
Photoresist viscosity: 0-1000Cp (optional high viscosity)
Rubber pump type: pneumatic or electric rubber pump
Photoresist or developer tubing:<= 3-way
Flow monitoring: Float flowmeter (optional ultrasonic flowmeter)
Raw liquid unit: Drum200L * 2ea (compatible with 20L)
Mixing unit: 60/80/100/110L specification quantity optional (special specifications can be customized)
Supply mode: Variable frequency control of maglev pump
Supply flow rate: ≥ 15LPM (please consult if exceeded)
Supply points: ≤ 5 supply points
Tank 360 ° automatic rotation cleaning function
Tank N2 moisturizing function, humidity ≥ 95%
Adjustable constant volume H2O2 feeding function, concentration range of 0.3% -5% (± 0.005%)
H2O2 concentration titration function (optional)
Raw liquid unit: Drum200L * 2/4/8ea (quantity optional)
Mixing unit: 250L/500L, with optional quantity (special specifications can be customized)
Supply mode: Variable frequency control of maglev pump
Supply flow rate: ≥ 30LPM (customizable design)
Supply points: ≤ 20 supply points (if exceeded, please consult)
Slurry quality detection function (density/pH/conductivity)
Optional Slurry particle and particle size detection function (LPC/MPS)
H2O2 concentration titration function
H2O2 concentration online monitoring function
供应PCW温控功能（供应主回路24±2°C）
Tank 360 ° automatic rotation cleaning function
Tank N2 moisturizing function, humidity ≥ 95%
Adjustable constant volume H2O2 feeding function, concentration range of 0.3% -5% (± 0.005%)
Slurry H2O2 concentration online detection function (optional)
Applicable chemicals include acidic, alkaline, oxidizing, organic solvents, corrosive organic solvents, and so on.
According to the demand for production line scale, there are the following supply methods to choose from:
Lorry liquid supply system: generally used in systems with very high daily chemical usage (such as H2SO4/NH4OH/H2SO4/TMAH/EBR for semiconductors).
Supply Tank supply system: The 200L dual drum configured in the CDM device automatically switches to supply liquid to the Supply tank, and then supplies liquid to the VMB from the Supply Tank; This system is generally applied to systems with large daily chemical usage (200L-1000L).
N2 nitrogen pressure supply system: The 200L dual drum configured in the CDM equipment automatically switches to replenish liquid to the nitrogen pressure tank, and then supplies liquid to VMB from the nitrogen pressure tank; This system is generally applied to systems with large daily chemical consumption (200L-1000L) and high specific gravity viscosity of chemicals (such as H2SO4/H3PO4).
DRUM direct supply system: generally used in systems with small daily chemical usage (less than 200L).
Mixing dilution system: generally used for mixing multiple chemicals in proportion or supplying high concentration raw liquid chemicals to process equipment after dilution (such as HF100:1, TMAH2.38%, SC-1 system for semiconductors).
Independent PLC and human-machine interface control, which can be connected to the upper computer monitoring system through the network; The concept of BIM air traffic control runs through the entire design and construction process.
Applicable to the liquid supply requirements of Thin film and Diff main equipment
Multiple models including LCSS, TCSS, and BCSS, with optional VMB configuration, customized design according to customer needs
The equipment has EMO and leakage protection, and the system design complies with SEMI S2 certification
Equipped with degasser helium removal device
The device uses a Venturi device, eliminating the need for additional pumps and saving costs
The machine comes with a heating belt, which is used to cooperate with the Venturi device to purge the pipeline
The machine is equipped with both weighing and liquid level detection
Added PN2 pipeline, replacing helium with PN2 for purge, saving a lot of costs
Suitable for high-temperature plasma treatment of semiconductor or compound process gases.
PFCs gas: CF4, SF6, NF3, etc
Corrosive gases: Cl2, F2, BCl3, HBr, etc
Combustible gases: SiH4, TEOS, DCS, H2, etc
Process used:Dry etch/Thin Film/Implant
Advantages:Plasma torch can release high temperatures exceeding 3000 ℃, making it more efficient in handling flammable gases, toxic gases, and PFC gases.
Especially the ability to handle PFC gases.
The specially designed water spray system does not produce water mist during the treatment of water-soluble waste gas.
Suitable for high-temperature plasma treatment of semiconductor or compound process gases.
PFCs gas: CF4, SF6, NF3, etc
Corrosive gases: Cl2, F2, BCl3, HBr, etc
Combustible gases: SiH4, TEOS, DCS, H2, etc
Process used:Dry etch/Thin Film/Implant
Advantages:Easy installation and maintenance, with short PM time.
The exhaust inlet pipe can be KF50 to avoid dust adhesion and prolong the PM cycle.
Unique internal structural design, economical C O. O and C O. C, low usage cost.
Optional water-saving model, water recycling, with extremely low water consumption.
Efficient high-temperature burners are used in various manufacturing processes to effectively select high and low power, reducing operating costs.
Use adsorption and adsorption medium to treat semiconductor or compound process gas
Injecting gas (ASH3, PH3, BF3, etc.)
Corrosive gas (F2, CL2, BCL3, HBR, etc.)
Process used:Dry etch/Implant/MOCVD(AsH3)/PLD(SiC)
Principle:Gas treatment is carried out through the chemical adsorption particles of G-FLYING CLEARB.
The basic component of the device inside the absorption tower is G-FLYING CLEARB chemisorbed particles.
The adsorption process forms stable salt separation of harmful process gases through chemical conversion (chemical adsorption), which takes place at room temperature without the need for external heating, humidification, or other functional facilities.
The chemical absorption reaction between gas and absorbent is irreversible, ensuring that hazardous gases remain in solid form.
Energy -saving: Adopting advanced structural design and control technology can greatly reduce energy consumption and save operating costs.
Stable and reliable: Using high -quality materials and components, after strict testing and inspection, it can run stable for a long time to ensure production efficiency and quality.
Simple operation: Adopt a intelligent control system, easy to operate, and can automatically adjust the temperature and refrigeration as according to the need, and the operation is convenient and fast.
Temperature range: -70 ℃ ~ 250 ℃
Temperature control accuracy: ± 0.01 ℃ ~ ± 0.1 ℃
Refrigeration power: 200W ~ 200KW
Scope of application: ETCH, Thin Film, ion injection and other semiconductor equipment
Energy -saving: Adopting advanced structural design and control technology can greatly reduce energy consumption and save operating costs.
Stable and reliable: Using high -quality materials and components, after strict testing and inspection, it can run stable for a long time to ensure production efficiency and quality.
Simple operation: Adopt a intelligent control system, easy to operate, and can automatically adjust the temperature and refrigeration as according to the need, and the operation is convenient and fast.
Temperature range: -70 ℃ ~ 250 ℃
Temperature control accuracy: ± 0.01 ℃ ~ ± 0.1 ℃
Refrigeration power: 200W ~ 200KW
Scope of application: ETCH, Thin Film, ion injection and other semiconductor equipment
Energy -saving: Adopting advanced structural design and control technology can greatly reduce energy consumption and save operating costs.
Stable and reliable: Using high -quality materials and components, after strict testing and inspection, it can run stable for a long time to ensure production efficiency and quality.
Simple operation: Adopt a intelligent control system, easy to operate, and can automatically adjust the temperature and refrigeration as according to the need, and the operation is convenient and fast.
Temperature range: -70 ℃ ~ 250 ℃
Temperature control accuracy: ± 0.01 ℃ ~ ± 0.1 ℃
Refrigeration power: 200W ~ 200KW
Scope of application: ETCH, Thin Film, ion injection and other semiconductor equipment
